MC9S08RG32FJR2
vs
MC9S08RE16FJ
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
QFP
QFP
Package Description
7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MS-026BBA, LQFP-32
LQFP, QFP32,.35SQ,32
Pin Count
32
32
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-PQFP-G32
S-PQFP-G32
JESD-609 Code
e0
Length
7 mm
7 mm
Moisture Sensitivity Level
3
Number of I/O Lines
27
27
Number of Terminals
32
32
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel)
225
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
8 MHz
8 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
1.8 V
1.8 V
Supply Voltage-Nom
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
7 mm
7 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
4
On Chip Program ROM Width
8
Package Equivalence Code
QFP32,.35SQ,32
RAM (bytes)
1024
ROM (words)
16384
Supply Current-Max
4.8 mA
Compare MC9S08RG32FJR2 with alternatives
Compare MC9S08RE16FJ with alternatives