MC9S08RG32FJE
vs
MC9S08RD32CFJE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
4 Weeks
JESD-609 Code
e3
e3
Moisture Sensitivity Level
3
3
Peak Reflow Temperature (Cel)
260
260
Technology
CMOS
CMOS
Terminal Finish
MATTE TIN
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
40
40
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Part Package Code
QFP
Package Description
LQFP, QFP32,.35SQ,32
Pin Count
32
ECCN Code
EAR99
Has ADC
NO
Address Bus Width
Bit Size
8
Clock Frequency-Max
16 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
JESD-30 Code
S-PQFP-G32
Length
7 mm
Number of I/O Lines
27
Number of Terminals
32
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
Package Code
LQFP
Package Equivalence Code
QFP32,.35SQ,32
Package Shape
SQUARE
Package Style
FLATPACK, LOW PROFILE
Qualification Status
Not Qualified
RAM (bytes)
2048
ROM (words)
32768
ROM Programmability
FLASH
Seated Height-Max
1.6 mm
Speed
8 MHz
Supply Current-Max
4.8 mA
Supply Voltage-Max
3.6 V
Supply Voltage-Min
1.8 V
Supply Voltage-Nom
3 V
Surface Mount
YES
Temperature Grade
INDUSTRIAL
Terminal Form
GULL WING
Terminal Pitch
0.8 mm
Terminal Position
QUAD
Width
7 mm
Compare MC9S08RG32FJE with alternatives
Compare MC9S08RD32CFJE with alternatives