MC9S08RG32FJ vs MC9S08RE8FDE feature comparison

MC9S08RG32FJ Motorola Mobility LLC

Buy Now Datasheet

MC9S08RE8FDE NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Transferred Active
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code QFP
Package Description LQFP, QFP32,.35SQ,32 7 X 7 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VKKD-2, TQFN-48
Pin Count 32
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G32 S-XQCC-N48
Length 7 mm 7 mm
Number of I/O Lines 27 39
Number of Terminals 32 48
On Chip Program ROM Width 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code LQFP HVQCCN
Package Equivalence Code QFP32,.35SQ,32 LCC48,.27SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
RAM (bytes) 2048 1024
ROM (words) 32768 8192
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1 mm
Speed 8 MHz 8 MHz
Supply Current-Max 4.8 mA 4.8 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.8 V 3 V
Supply Voltage-Nom 2 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7 mm 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Boundary Scan NO
CPU Family HCS08
Format FIXED POINT
Integrated Cache NO
Low Power Mode YES
Number of External Interrupts 1
Number of Serial I/Os 1
Number of Timers 3
On Chip Data RAM Width 8

Compare MC9S08RG32FJ with alternatives

Compare MC9S08RE8FDE with alternatives