MC9S08RG32CFG vs MC9S08RG60CFJE feature comparison

MC9S08RG32CFG Rochester Electronics LLC

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MC9S08RG60CFJE NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC NXP SEMICONDUCTORS
Part Package Code QFP
Package Description LQFP, ,
Pin Count 44
Reach Compliance Code unknown unknown
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G44 S-PQFP-G32
Length 10 mm 7 mm
Number of I/O Lines 39 27
Number of Terminals 44 32
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.6 mm
Speed 8 MHz 8 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.8 V 3 V
Supply Voltage-Nom 2 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 10 mm 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 4 3
HTS Code 8542.31.00.01
Factory Lead Time 4 Weeks
Boundary Scan NO
CPU Family HCS08
Format FIXED POINT
Integrated Cache NO
JESD-609 Code e3
Low Power Mode YES
Moisture Sensitivity Level 3
Number of External Interrupts 1
Number of Serial I/Os 1
Number of Timers 3
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Package Equivalence Code QFP32,.35SQ,32
Peak Reflow Temperature (Cel) 260
RAM (bytes) 2048
ROM (words) 61440
Supply Current-Max 4.8 mA
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 40

Compare MC9S08RG32CFG with alternatives

Compare MC9S08RG60CFJE with alternatives