MC9S08RE8FDE
vs
MC9S08RG32DWE
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
7 X 7 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VKKD-2, TQFN-48
|
SOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
|
| CPU Family |
HCS08
|
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
S-XQCC-N48
|
R-PDSO-G28
|
| Length |
7 mm
|
17.925 mm
|
| Low Power Mode |
YES
|
|
| Number of External Interrupts |
1
|
|
| Number of I/O Lines |
39
|
23
|
| Number of Serial I/Os |
1
|
|
| Number of Terminals |
48
|
28
|
| Number of Timers |
3
|
|
| On Chip Data RAM Width |
8
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Equivalence Code |
LCC48,.27SQ,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
1024
|
|
| ROM (words) |
8192
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1 mm
|
2.65 mm
|
| Speed |
8 MHz
|
8 MHz
|
| Supply Current-Max |
4.8 mA
|
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
1.8 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
7 mm
|
7.5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
28
|
|
|
|
Compare MC9S08RE8FDE with alternatives
Compare MC9S08RG32DWE with alternatives