MC9S08RE16PE
vs
MC9S08RE60CFJ
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Package Description
ROHS COMPLIANT, PLASTIC, DIP-28
LQFP, QFP32,.35SQ,32
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
Boundary Scan
NO
CPU Family
HCS08
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
R-PDIP-T28
S-PQFP-G32
Length
36.83 mm
7 mm
Low Power Mode
YES
Number of External Interrupts
1
Number of I/O Lines
23
27
Number of Serial I/Os
1
Number of Terminals
28
32
Number of Timers
3
On Chip Data RAM Width
8
On Chip Program ROM Width
8
8
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
LQFP
Package Equivalence Code
DIP28,.6
QFP32,.35SQ,32
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
FLATPACK, LOW PROFILE
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
1024
2048
ROM (words)
16384
61440
ROM Programmability
FLASH
FLASH
Seated Height-Max
5.08 mm
1.6 mm
Speed
8 MHz
8 MHz
Supply Current-Max
4.8 mA
4.8 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
1.8 V
Supply Voltage-Nom
3 V
2 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.8 mm
Terminal Position
DUAL
QUAD
Width
15.24 mm
7 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
3
Rohs Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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