MC9S08RE16FJE vs MC9S08RE8FDE feature comparison

MC9S08RE16FJE NXP Semiconductors

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MC9S08RE8FDE Freescale Semiconductor

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description , HVQCCN,
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Boundary Scan NO
CPU Family HCS08
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
Format FIXED POINT
Integrated Cache NO
JESD-30 Code S-PQFP-G32 S-XQCC-N48
JESD-609 Code e3
Length 7 mm 7 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of External Interrupts 1
Number of I/O Lines 27 39
Number of Serial I/Os 1
Number of Terminals 32 48
Number of Timers 3
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code LQFP HVQCCN
Package Equivalence Code QFP32,.35SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
RAM (bytes) 1024
ROM (words) 16384
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1 mm
Speed 8 MHz 8 MHz
Supply Current-Max 4.8 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 1.8 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 7 mm 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Part Package Code QFN
Pin Count 48
Qualification Status Not Qualified
Temperature Grade COMMERCIAL

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