MC9S08RE16FJ vs MC9S08RE32CFJ feature comparison

MC9S08RE16FJ Rochester Electronics LLC

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MC9S08RE32CFJ Freescale Semiconductor

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC FREESCALE SEMICONDUCTOR INC
Part Package Code QFP QFP
Package Description LQFP, 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MS-026BBA, LQFP-32
Pin Count 32 32
Reach Compliance Code unknown not_compliant
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G32 S-PQFP-G32
Length 7 mm 7 mm
Number of I/O Lines 27 27
Number of Terminals 32 32
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.6 mm
Speed 8 MHz 8 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.8 V 2 V
Supply Voltage-Nom 2 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 7 mm 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 4 4
Rohs Code No
ECCN Code EAR99
HTS Code 8542.31.00.01
JESD-609 Code e0
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Package Equivalence Code QFP32,.35SQ,32
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified
RAM (bytes) 2048
ROM (words) 32768
Supply Current-Max 4.8 mA
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 30

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