MC9S08RE16FG
vs
MC9S08RE8CFDE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
QFP
QFN
Package Description
LQFP, QFP44,.47SQ,32
HVQCCN,
Pin Count
44
48
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-PQFP-G44
S-XQCC-N48
Length
10 mm
7 mm
Number of I/O Lines
39
39
Number of Terminals
44
48
On Chip Program ROM Width
8
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
LQFP
HVQCCN
Package Equivalence Code
QFP44,.47SQ,32
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
1024
ROM (words)
16384
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1 mm
Speed
8 MHz
8 MHz
Supply Current-Max
4.8 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
1.8 V
1.8 V
Supply Voltage-Nom
2 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
10 mm
7 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
4
2
Compare MC9S08RE16FG with alternatives
Compare MC9S08RE8CFDE with alternatives