MC9S08RE16FG vs MC9S08RE16FDE feature comparison

MC9S08RE16FG Rochester Electronics LLC

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MC9S08RE16FDE Freescale Semiconductor

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Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS INC FREESCALE SEMICONDUCTOR INC
Part Package Code QFP QFN
Package Description LQFP, HVQCCN, LCC48,.27SQ,20
Pin Count 44 48
Reach Compliance Code unknown unknown
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G44 S-XQCC-N48
Length 10 mm 7 mm
Number of I/O Lines 39 39
Number of Terminals 44 48
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code LQFP HVQCCN
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1 mm
Speed 8 MHz 8 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.8 V 1.8 V
Supply Voltage-Nom 2 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position QUAD QUAD
Width 10 mm 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 4 2
Rohs Code Yes
ECCN Code EAR99
HTS Code 8542.31.00.01
JESD-609 Code e4
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Package Equivalence Code LCC48,.27SQ,20
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 1024
ROM (words) 16384
Supply Current-Max 4.8 mA
Time@Peak Reflow Temperature-Max (s) 40

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