MC9S08RE16CFJ
vs
MC9S08RG60CFJE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
QFP
Package Description
7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MS-026BBA, LQFP-32
,
Pin Count
32
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-PQFP-G32
S-PQFP-G32
JESD-609 Code
e0
e3
Length
7 mm
7 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
27
27
Number of Terminals
32
32
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Equivalence Code
QFP32,.35SQ,32
QFP32,.35SQ,32
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel)
240
260
Qualification Status
Not Qualified
RAM (bytes)
1024
2048
ROM (words)
16384
61440
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
8 MHz
8 MHz
Supply Current-Max
4.8 mA
4.8 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
2 V
3 V
Supply Voltage-Nom
2 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
40
Width
7 mm
7 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
1
Factory Lead Time
4 Weeks
Boundary Scan
NO
CPU Family
HCS08
Format
FIXED POINT
Integrated Cache
NO
Low Power Mode
YES
Number of External Interrupts
1
Number of Serial I/Os
1
Number of Timers
3
On Chip Data RAM Width
8
Compare MC9S08RE16CFJ with alternatives
Compare MC9S08RG60CFJE with alternatives