MC9S08RE16CFDER
vs
MC9S08RD60FJ
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
QFN
QFP
Package Description
7 X 7 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VKKD-2, TQFN-48
LQFP, QFP32,.35SQ,32
Pin Count
48
32
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-XQCC-N48
S-PQFP-G32
Length
7 mm
7 mm
Moisture Sensitivity Level
3
Number of I/O Lines
39
27
Number of Terminals
48
32
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
YES
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
LQFP
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
ROM (words)
16384
61440
ROM Programmability
FLASH
FLASH
Seated Height-Max
1 mm
1.6 mm
Speed
8 MHz
8 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
1.8 V
Supply Voltage-Nom
3 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
7 mm
7 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
3
Package Equivalence Code
QFP32,.35SQ,32
RAM (bytes)
2048
Supply Current-Max
4.8 mA
Compare MC9S08RE16CFDER with alternatives
Compare MC9S08RD60FJ with alternatives