MC9S08RD60DWE vs MC9S08RD60CDWE feature comparison

MC9S08RD60DWE Freescale Semiconductor

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MC9S08RD60CDWE NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description ROHS COMPLIANT, MS-013AE, SOIC-28
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G28 R-PDSO-G28
JESD-609 Code e3
Length 17.925 mm 17.925 mm
Moisture Sensitivity Level 3
Number of I/O Lines 23 23
Number of Terminals 28 28
On Chip Program ROM Width 8 8
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP28,.4 SOP28,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified
RAM (bytes) 2048 2048
ROM (words) 61440 61440
ROM Programmability FLASH FLASH
Seated Height-Max 2.65 mm 2.65 mm
Speed 8 MHz 8 MHz
Supply Current-Max 4.8 mA 4.8 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.8 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Width 7.5 mm 7.5 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Factory Lead Time 4 Weeks
Boundary Scan NO
CPU Family HCS08
Format FIXED POINT
Integrated Cache NO
Low Power Mode YES
Number of External Interrupts 1
Number of Serial I/Os 1
Number of Timers 3
On Chip Data RAM Width 8