MC9S08RC8FJE
vs
MC9S08RE8CFDE
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
QFP
|
QFN
|
Package Description |
7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BBA, LQFP-32
|
HVQCCN,
|
Pin Count |
32
|
48
|
Reach Compliance Code |
unknown
|
unknown
|
Has ADC |
NO
|
NO
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
Clock Frequency-Max |
16 MHz
|
16 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQFP-G32
|
S-XQCC-N48
|
JESD-609 Code |
e3
|
|
Length |
7 mm
|
7 mm
|
Moisture Sensitivity Level |
3
|
|
Number of I/O Lines |
27
|
39
|
Number of Terminals |
32
|
48
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
LQFP
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.6 mm
|
1 mm
|
Speed |
8 MHz
|
8 MHz
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
1.8 V
|
1.8 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.8 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
7 mm
|
7 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
HTS Code |
|
8542.31.00.01
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare MC9S08RC8FJE with alternatives
Compare MC9S08RE8CFDE with alternatives