MC9S08RC8FJE
vs
MC9S08RC8CFJ
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS INC
|
| Package Description |
,
|
LQFP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Technology |
CMOS
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
32
|
| Has ADC |
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
|
8
|
| Clock Frequency-Max |
|
16 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
|
S-PQFP-G32
|
| Length |
|
7 mm
|
| Number of I/O Lines |
|
27
|
| Number of Terminals |
|
32
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LQFP
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK, LOW PROFILE
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
1.6 mm
|
| Speed |
|
8 MHz
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
1.8 V
|
| Supply Voltage-Nom |
|
2 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
7 mm
|
|
|
|
Compare MC9S08RC8FJE with alternatives
Compare MC9S08RC8CFJ with alternatives