MC9S08RC8CFJ
vs
MC9S08RC8FJE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MOTOROLA INC
ROCHESTER ELECTRONICS LLC
Part Package Code
QFP
QFP
Package Description
LQFP, QFP32,.35SQ,32
7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BBA, LQFP-32
Pin Count
32
32
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-PQFP-G32
S-PQFP-G32
Length
7 mm
7 mm
Number of I/O Lines
27
27
Number of Terminals
32
32
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Equivalence Code
QFP32,.35SQ,32
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
RAM (bytes)
1024
ROM (words)
8192
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
8 MHz
8 MHz
Supply Current-Max
4.8 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
1.8 V
1.8 V
Supply Voltage-Nom
2 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Width
7 mm
7 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
4
3
Pbfree Code
Rohs Code
JESD-609 Code
e3
Moisture Sensitivity Level
3
Terminal Finish
MATTE TIN
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