MC9S08QG8CPBE vs MC9S08QG8CFFE feature comparison

MC9S08QG8CPBE NXP Semiconductors

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MC9S08QG8CFFE NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description ROHS COMPLIANT, PLASTIC, DIP-16 5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 20 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDIP-T16 S-XQCC-N16
JESD-609 Code e3 e3
Length 19.175 mm 5 mm
Number of I/O Lines 14 14
Number of Terminals 16 16
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP HVQCCN
Package Equivalence Code DIP16,.3 LCC16,.2SQ,32
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 512 512
ROM (words) 8192 8192
ROM Programmability FLASH FLASH
Seated Height-Max 4.44 mm 1 mm
Speed 20 MHz 20 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) Matte Tin (Sn)
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 0.8 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 7.62 mm 5 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 2
Factory Lead Time 13 Weeks
Moisture Sensitivity Level 3

Compare MC9S08QG8CPBE with alternatives

Compare MC9S08QG8CFFE with alternatives