MC9S08QG8CFKE
vs
MC9S08QG8CFFE
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
|
| Package Description |
4 X 4 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VGGD-8, QFN-24
|
5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-XQCC-N24
|
S-XQCC-N16
|
| Length |
4 mm
|
5 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of I/O Lines |
14
|
14
|
| Number of Terminals |
24
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Speed |
20 MHz
|
20 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
1.8 V
|
3 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NOT SPECIFIED
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
4 mm
|
5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
3A991.A.2
|
| HTS Code |
|
8542.31.00.01
|
| Factory Lead Time |
|
13 Weeks
|
| Samacsys Manufacturer |
|
NXP
|
| JESD-609 Code |
|
e3
|
| On Chip Program ROM Width |
|
8
|
| Package Equivalence Code |
|
LCC16,.2SQ,32
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
512
|
| ROM (words) |
|
8192
|
|
|
|
Compare MC9S08QG8CFKE with alternatives
Compare MC9S08QG8CFFE with alternatives