MC9S08QG8CFKE vs MC9S08QG8MFFE feature comparison

MC9S08QG8CFKE NXP Semiconductors

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MC9S08QG8MFFE NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 4 X 4 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VGGD-8, QFN-24 5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks 13 Weeks
Samacsys Manufacturer NXP NXP
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 20 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-XQCC-N24 S-XQCC-N16
JESD-609 Code e3
Length 4 mm 5 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 14 14
Number of Terminals 24 16
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code HVQCCN HVQCCN
Package Equivalence Code LCC24,.16SQ,20 LCC16,.2SQ,32
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 512 512
ROM (words) 8192 8192
ROM Programmability FLASH FLASH
Seated Height-Max 1 mm 1 mm
Speed 20 MHz 20 MHz
Supply Current-Max 5 mA 5 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 1.8 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin (Sn)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 40
Width 4 mm 5 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1

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