MC9S08QG8CDNER
vs
MC9S08QG8MDNE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
SOP,
SOP, SOP8,.25
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
EAR99
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
20 MHz
20 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e3
e3
Length
4.9 mm
4.9 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
6
6
Number of Terminals
8
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.75 mm
1.75 mm
Speed
20 MHz
20 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
1.8 V
1.8 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Tin (Sn)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
40
Width
3.9 mm
3.9 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Pbfree Code
Part Package Code
SOIC
Pin Count
8
On Chip Program ROM Width
8
Package Equivalence Code
SOP8,.25
RAM (bytes)
512
ROM (words)
8192
Supply Current-Max
5 mA
Compare MC9S08QG8CDNER with alternatives
Compare MC9S08QG8MDNE with alternatives