MC9S08QG8CDNE
vs
MC9S08QG8CFFE
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
Package Description
SOP,
5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16
Pin Count
8
Reach Compliance Code
unknown
compliant
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
20 MHz
20 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-PDSO-G8
S-XQCC-N16
JESD-609 Code
e3
e3
Length
4.9 mm
5 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
6
14
Number of Terminals
8
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
SOP
HVQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.75 mm
1 mm
Speed
20 MHz
20 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
1.8 V
3 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
0.8 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
3.9 mm
5 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
2
Rohs Code
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
On Chip Program ROM Width
8
Package Equivalence Code
LCC16,.2SQ,32
Qualification Status
Not Qualified
RAM (bytes)
512
ROM (words)
8192
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