MC9S08QG4MFQE
vs
MC9S08QG4MDTE
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Technology |
CMOS
|
CMOS
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| Package Description |
|
0.65 MM PITCH, ROHS COMPLIANT, TSSOP-16
|
| ECCN Code |
|
3A991.A.2
|
| Factory Lead Time |
|
13 Weeks
|
| Samacsys Manufacturer |
|
NXP
|
| Has ADC |
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
|
8
|
| Clock Frequency-Max |
|
20 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
|
R-PDSO-G16
|
| JESD-609 Code |
|
e3
|
| Length |
|
5 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of I/O Lines |
|
14
|
| Number of Terminals |
|
16
|
| On Chip Program ROM Width |
|
8
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
256
|
| ROM (words) |
|
4096
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
1.2 mm
|
| Speed |
|
20 MHz
|
| Supply Current-Max |
|
5 mA
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
1.8 V
|
| Supply Voltage-Nom |
|
3 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
Tin (Sn)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
4.4 mm
|
|
|
|
Compare MC9S08QG4MFQE with alternatives
Compare MC9S08QG4MDTE with alternatives