MC9S08QG4CDNE vs MC9S08QG4CPAE feature comparison

MC9S08QG4CDNE Rochester Electronics LLC

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MC9S08QG4CPAE NXP Semiconductors

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Pbfree Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description SOP, ROHS COMPLIANT, PLASTIC, DIP-8
Pin Count 8
Reach Compliance Code unknown compliant
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 20 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G8 R-PDIP-T8
JESD-609 Code e3 e3
Length 4.9 mm 9.779 mm
Moisture Sensitivity Level 3
Number of I/O Lines 6 6
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
ROM Programmability FLASH FLASH
Seated Height-Max 1.75 mm 5.334 mm
Speed 20 MHz 20 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.8 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN Tin (Sn)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 3.9 mm 7.62 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 3 3
Rohs Code Yes
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
On Chip Program ROM Width 8
Package Equivalence Code DIP8,.3
Qualification Status Not Qualified
RAM (bytes) 256
ROM (words) 4096

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Compare MC9S08QG4CPAE with alternatives