MC9S08GT60ACFB
vs
MC9S08GT60ACFBE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ROCHESTER ELECTRONICS LLC
Package Description
,
10 X 10 MM, 2 MM HEIGHT, 0.8 MM PITCH, QFP-44
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
3
Pbfree Code
Part Package Code
QFP
Pin Count
44
Has ADC
YES
Address Bus Width
Bit Size
8
Clock Frequency-Max
40 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
JESD-30 Code
S-PQFP-G44
JESD-609 Code
e3
Length
10 mm
Moisture Sensitivity Level
3
Number of I/O Lines
36
Number of Terminals
44
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
Package Code
QFP
Package Shape
SQUARE
Package Style
FLATPACK
Peak Reflow Temperature (Cel)
260
ROM Programmability
FLASH
Seated Height-Max
2.45 mm
Speed
40 MHz
Supply Voltage-Max
3.6 V
Supply Voltage-Min
2.08 V
Supply Voltage-Nom
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
Terminal Pitch
0.8 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
40
Width
10 mm
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