MC9S08GB60ACFUER
vs
MC9S08GB60ACFUE
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
ROCHESTER ELECTRONICS LLC
Part Package Code
QFP
QFP
Package Description
10 X 10 MM, 1.40 MM HEIGHT, 0.5 MM PITCH, MS-026BCD, LQFP-64
10 X 10 MM, 1.40 MM HEIGHT, 0.5 MM PITCH, MS-026BCD, LQFP-64
Pin Count
64
64
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.31.00.01
Has ADC
YES
YES
Additional Feature
OPERATES AT 1.8V MINIMUM SUPPLY
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
40 MHz
40 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
JESD-609 Code
e3
e3
Length
10 mm
10 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
56
56
Number of Terminals
64
64
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFQFP
Package Equivalence Code
QFP64,.47SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
RAM (bytes)
4096
ROM (words)
61440
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
40 MHz
40 MHz
Supply Current-Max
7.5 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
2.08 V
2.08 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
10 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Compare MC9S08GB60ACFUER with alternatives
Compare MC9S08GB60ACFUE with alternatives