MC9S08AW60MFU vs MC9S08AW60MFUE feature comparison

MC9S08AW60MFU NXP Semiconductors

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MC9S08AW60MFUE NXP Semiconductors

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Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 14 X 14 MM, PLASTIC, QFP-64 14 X 14 MM, LEAD FREE, PLASTIC, QFP-64
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Boundary Scan NO
Clock Frequency-Max 40 MHz 40 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G64 S-PQFP-G64
Length 14 mm 14 mm
Number of I/O Lines 54 54
Number of Terminals 64 64
On Chip Program ROM Width 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Qualification Status Not Qualified Not Qualified
ROM (words) 63280 63280
ROM Programmability FLASH FLASH
Seated Height-Max 2.45 mm 2.45 mm
Speed 40 MHz 40 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.7 V 2.7 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 3 2
Rohs Code Yes
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
JESD-609 Code e3
Moisture Sensitivity Level 3
Package Equivalence Code QFP64,.7SQ,32
Peak Reflow Temperature (Cel) 260
RAM (bytes) 2048
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40

Compare MC9S08AW60MFU with alternatives

Compare MC9S08AW60MFUE with alternatives