MC9S08AW60CFGER
vs
MC9S08AW60MFGE
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
QFP
Package Description
10 X 10 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MS-026BCB, LQFP-44
10 X 10 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MS-026BCB, LQFP-44
Pin Count
44
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
40 MHz
40 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-PQFP-G44
S-PQFP-G44
JESD-609 Code
e3
e3
Length
10 mm
10 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
54
54
Number of Terminals
44
44
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Equivalence Code
QFP44,.47SQ,32
QFP44,.47SQ,32
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
2048
2048
ROM (words)
63280
63280
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
40 MHz
40 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.7 V
2.7 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
10 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
2
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Compare MC9S08AW60CFGER with alternatives
Compare MC9S08AW60MFGE with alternatives