MC9S08AW32CFU
vs
MC9S08AW60CFUE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
QFP
Package Description
QFP,
14 X 14 MM, LEAD FREE, PLASTIC, QFP-64
Pin Count
64
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
40 MHz
40 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
Length
14 mm
14 mm
Number of I/O Lines
54
54
Number of Terminals
64
64
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.45 mm
2.45 mm
Speed
40 MHz
40 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.7 V
3 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
3
2
Rohs Code
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
JESD-609 Code
e3
Moisture Sensitivity Level
3
On Chip Program ROM Width
8
Package Equivalence Code
QFP64,.7SQ,32
Peak Reflow Temperature (Cel)
260
RAM (bytes)
2048
ROM (words)
63280
Terminal Finish
Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
40
Compare MC9S08AW32CFU with alternatives
Compare MC9S08AW60CFUE with alternatives