MC9S08AW16MPUE
vs
MC9S08AW48CPUE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
10 X 10 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, MS-026BCD, LQFP-64
10 X 10 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, MS-026BCD, LQFP-64
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
13 Weeks
Samacsys Manufacturer
NXP
NXP
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
40 MHz
40 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
JESD-609 Code
e3
e3
Length
10 mm
10 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
54
54
Number of Terminals
64
64
On Chip Program ROM Width
8
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFQFP
Package Equivalence Code
QFP64,.47SQ,20
QFP64,.47SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
1024
2048
ROM (words)
16384
49152
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
40 MHz
40 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.7 V
3 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Tin (Sn)
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
10 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
2
Compare MC9S08AW16MPUE with alternatives
Compare MC9S08AW48CPUE with alternatives