MC94MX21DVKN3
vs
MCIMX286DVM4B
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Not Recommended
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
14 X 14 MM, 1.41 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, BGA-289
|
MABGA-289
|
Pin Count |
289
|
|
Reach Compliance Code |
unknown
|
compliant
|
Address Bus Width |
26
|
|
Boundary Scan |
YES
|
|
Clock Frequency-Max |
350 MHz
|
|
External Data Bus Width |
32
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PBGA-B289
|
S-PBGA-B289
|
JESD-609 Code |
e1
|
e1
|
Length |
14 mm
|
14 mm
|
Low Power Mode |
YES
|
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
289
|
289
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-30 °C
|
-20 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Seated Height-Max |
1.49 mm
|
1.37 mm
|
Speed |
350 MHz
|
|
Supply Voltage-Max |
1.8 V
|
1.55 V
|
Supply Voltage-Min |
1.65 V
|
1.35 V
|
Supply Voltage-Nom |
1.7 V
|
1.45 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
14 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
SoC
|
Base Number Matches |
3
|
2
|
ECCN Code |
|
5A992.C
|
HTS Code |
|
8542.31.00.01
|
Factory Lead Time |
|
18 Weeks
|
Samacsys Manufacturer |
|
NXP
|
Additional Feature |
|
IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V
|
Package Equivalence Code |
|
BGA289,17X17,32
|
|
|
|