MC9328MXLVP15R2
vs
MC9328MXSVP10R2
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
13 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-225
|
LFBGA,
|
| Pin Count |
225
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
|
| Address Bus Width |
25
|
25
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
S-PBGA-B225
|
S-PBGA-B225
|
| JESD-609 Code |
e1
|
e1
|
| Length |
13 mm
|
13 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
225
|
225
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Speed |
150 MHz
|
100 MHz
|
| Supply Voltage-Max |
1.9 V
|
1.9 V
|
| Supply Voltage-Min |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
13 mm
|
13 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
3
|
2
|
| ECCN Code |
|
3A991.A.2
|
| HTS Code |
|
8542.31.00.01
|
| Technology |
|
CMOS
|
|
|
|
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