MC9328MXLCVM15
vs
MIP7965-750B1I
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
AEROFLEX PLAINVIEW
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LFBGA, BGA256,16X16,32
|
26 X 26 MM, MO-149BG-2X, TBGA-256
|
Pin Count |
256
|
256
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
25
|
|
Bit Size |
32
|
64
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
16 MHz
|
133 MHz
|
External Data Bus Width |
32
|
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
14 mm
|
27 mm
|
Low Power Mode |
YES
|
NO
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
BGA
|
Package Equivalence Code |
BGA256,16X16,32
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
|
Speed |
150 MHz
|
750 MHz
|
Supply Voltage-Max |
1.9 V
|
1.35 V
|
Supply Voltage-Min |
1.7 V
|
1.25 V
|
Supply Voltage-Nom |
1.8 V
|
1.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
14 mm
|
27 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
Base Number Matches |
2
|
1
|
ECCN Code |
|
3A991.A.2
|
Additional Feature |
|
ALSO REQUIRES 2.5V OR 3.3V SUPPLY
|
|
|
|
Compare MC9328MXLCVM15 with alternatives
Compare MIP7965-750B1I with alternatives