MC9328MXLCVF15R2 vs MC9328MXLVP20 feature comparison

MC9328MXLCVF15R2 Motorola Semiconductor Products

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MC9328MXLVP20 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Package Description 13 X 13 MM, 0.80 MM PITCH, PLASTIC, BGA-225 13 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-225
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 25 25
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 16 MHz 16 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B225 S-PBGA-B225
Length 13 mm 13 mm
Low Power Mode YES YES
Number of Terminals 225 225
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA225,15X15,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Speed 150 MHz 200 MHz
Supply Voltage-Max 1.9 V 2 V
Supply Voltage-Min 1.7 V 1.8 V
Supply Voltage-Nom 1.8 V 1.9 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 3 4
ECCN Code 3A991.A.2
Samacsys Manufacturer NXP
Additional Feature ALSO REQUIRES 3.3V SUPPLY
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) 40

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