MC9328MX1DVM20 vs XPC850DSLCZT50BU feature comparison

MC9328MX1DVM20 Motorola Mobility LLC

Buy Now Datasheet

XPC850DSLCZT50BU Freescale Semiconductor

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description LFBGA, BGA256,16X16,32 BGA, BGA256,16X16,50
Pin Count 256 256
Reach Compliance Code unknown not_compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 25 26
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 16 MHz 50 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 14 mm 23 mm
Low Power Mode NO YES
Number of Terminals 256 256
Operating Temperature-Max 70 °C
Operating Temperature-Min -30 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA BGA
Package Equivalence Code BGA256,16X16,32 BGA256,16X16,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 2.35 mm
Speed 200 MHz 50 MHz
Supply Voltage-Max 2 V 3.465 V
Supply Voltage-Min 1.8 V 3.135 V
Supply Voltage-Nom 1.9 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 23 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1
Rohs Code No
ECCN Code 5A991
Samacsys Manufacturer NXP
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 220
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 30

Compare MC9328MX1DVM20 with alternatives

Compare XPC850DSLCZT50BU with alternatives