MC92600CJUB
vs
MC92600CJUB
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
MOTOROLA INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
BGA,
|
Pin Count |
217
|
217
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
JESD-30 Code |
S-PBGA-B217
|
S-PBGA-B217
|
Length |
23 mm
|
23 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
217
|
217
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.32 mm
|
2.32 mm
|
Supply Voltage-Max |
1.95 V
|
1.95 V
|
Supply Voltage-Min |
1.65 V
|
1.65 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
23 mm
|
23 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
MICROPROCESSOR CIRCUIT
|
Base Number Matches |
1
|
1
|
|
|
|