MC908QB8CDTE
vs
MC908QB8MDTE
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
|
| Package Description |
0.65 MM PITCH, LEAD FREE, TSSOP-16
|
,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
|
| Additional Feature |
OPERATES AT 3V SUPPLY AT 4 MHZ
|
|
| Address Bus Width |
|
|
| Bit Size |
8
|
|
| CPU Family |
68HC08
|
|
| Clock Frequency-Max |
32 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G16
|
|
| JESD-609 Code |
e3
|
|
| Length |
5 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
14
|
|
| Number of Terminals |
16
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
256
|
|
| ROM (words) |
8192
|
|
| ROM Programmability |
FLASH
|
|
| Seated Height-Max |
1.2 mm
|
|
| Speed |
8 MHz
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
5 V
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
4.4 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
|
| Base Number Matches |
3
|
3
|
| Samacsys Manufacturer |
|
NXP
|
|
|
|
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