MC908QB4MDWE
vs
MC908QY4AMP
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
1.27 MM PITCH, LEAD FREE, PLASTIC, MS-013AA, SOIC-16
|
PLASTIC, DIP-16
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
OPERATES AT 3V SUPPLY AT 4 MHZ
|
ALSO OPERATES AT 3V SUPPLY AT 4 MHZ
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
32 MHz
|
32 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
| JESD-609 Code |
e3
|
e0
|
| Length |
10.3 mm
|
19.175 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
14
|
14
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
2.65 mm
|
4.44 mm
|
| Speed |
8 MHz
|
8 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Tin (Sn)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
7.5 mm
|
7.62 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
1
|
| CPU Family |
|
68HC08
|
| On Chip Program ROM Width |
|
8
|
| Package Equivalence Code |
|
DIP16,.3
|
| RAM (bytes) |
|
128
|
| ROM (words) |
|
4096
|
| Supply Current-Max |
|
7 mA
|
|
|
|
Compare MC908QB4MDWE with alternatives
Compare MC908QY4AMP with alternatives