MC8641DHX1250HC
vs
MC8641VU1000HB
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
33 X 33 MM, CERAMIC, BGA-1023
|
BGA, BGA1023,32X32,40
|
| Pin Count |
1023
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
3A991
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
1250 MHz
|
166.66 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-CBGA-B1023
|
S-CBGA-B1023
|
| JESD-609 Code |
e0
|
|
| Length |
33 mm
|
33 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
1023
|
1023
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.97 mm
|
2.77 mm
|
| Speed |
166.66 MHz
|
166.66 MHz
|
| Supply Voltage-Max |
1.1 V
|
1.1 V
|
| Supply Voltage-Min |
1 V
|
1 V
|
| Supply Voltage-Nom |
1.05 V
|
1.05 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
33 mm
|
33 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
2
|
| Operating Temperature-Max |
|
105 °C
|
| Operating Temperature-Min |
|
|
| Package Equivalence Code |
|
BGA1023,32X32,40
|
|
|
|
Compare MC8641DHX1250HC with alternatives
Compare MC8641VU1000HB with alternatives