MC8640TVU1000HC
vs
MC8641DHX1333HB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Reach Compliance Code
compliant
unknown
Base Number Matches
2
2
Package Description
BGA,
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
16
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
166.66 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-CBGA-B1023
Length
33 mm
Low Power Mode
YES
Number of Terminals
1023
Operating Temperature-Max
105 °C
Operating Temperature-Min
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Seated Height-Max
2.97 mm
Speed
1333 MHz
Supply Voltage-Max
1.1 V
Supply Voltage-Min
1 V
Supply Voltage-Nom
1.05 V
Surface Mount
YES
Technology
CMOS
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
33 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
Compare MC8641DHX1333HB with alternatives