MC8640THX1000HE
vs
MC8640VU1000HE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
HBGA, BGA1023,32X32,40
33 X 33 MM, ROHS COMPLIANT, CERAMIC, FCBGA-1023
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.1
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
166.66 MHz
166.66 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B1023
S-CBGA-B1023
Length
33 mm
33 mm
Low Power Mode
NO
YES
Moisture Sensitivity Level
1
3
Number of DMA Channels
4
Number of Terminals
1023
1023
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
HBGA
BGA
Package Equivalence Code
BGA1023,32X32,40
BGA1023,32X32,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.97 mm
2.97 mm
Speed
1000 MHz
1000 MHz
Supply Voltage-Max
1.1 V
1.1 V
Supply Voltage-Min
1 V
1 V
Supply Voltage-Nom
1.05 V
1.05 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
33 mm
33 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
1023
JESD-609 Code
e2
Peak Reflow Temperature (Cel)
245
Terminal Finish
Tin/Silver (Sn/Ag)
Time@Peak Reflow Temperature-Max (s)
30
Compare MC8640THX1000HE with alternatives
Compare MC8640VU1000HE with alternatives