MC8640DVJ1000HE vs PC8641DVGH1500JC feature comparison

MC8640DVJ1000HE NXP Semiconductors

Buy Now Datasheet

PC8641DVGH1500JC Teledyne e2v

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TELEDYNE E2V (UK) LTD
Package Description FCBGA-1023 BGA,
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.1 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 166.66 MHz 166.66 MHz
External Data Bus Width 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B1023 S-CBGA-B1023
JESD-609 Code e2
Length 33 mm 33 mm
Low Power Mode NO YES
Moisture Sensitivity Level 3
Number of DMA Channels 4
Number of Terminals 1023 1023
Operating Temperature-Max 105 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC CERAMIC, METAL-SEALED COFIRED
Package Code HBGA BGA
Package Equivalence Code BGA1023,32X32,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY
Peak Reflow Temperature (Cel) 245
Seated Height-Max 2.77 mm 2.97 mm
Speed 1000 MHz 1500 MHz
Supply Voltage-Max 1.1 V 1.1 V
Supply Voltage-Min 1 V 1 V
Supply Voltage-Nom 1.05 V 1.05 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER MILITARY
Terminal Finish Tin/Silver (Sn/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 33 mm 33 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 1 1
Part Package Code BGA
Pin Count 1023

Compare MC8640DVJ1000HE with alternatives

Compare PC8641DVGH1500JC with alternatives