MC8640DVJ1000HC
vs
MC8640DHX1000HE
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
BGA,
|
33 X 33 MM, CERAMIC, FCBGA-1023
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
16
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
External Data Bus Width |
64
|
32
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-CBGA-B1023
|
S-CBGA-B1023
|
Length |
33 mm
|
33 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
1023
|
1023
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Seated Height-Max |
2.77 mm
|
2.97 mm
|
Speed |
1000 MHz
|
1000 MHz
|
Supply Voltage-Max |
1.1 V
|
1.1 V
|
Supply Voltage-Min |
1 V
|
1 V
|
Supply Voltage-Nom |
1.05 V
|
1.05 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
33 mm
|
33 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
1023
|
ECCN Code |
|
3A991
|
Clock Frequency-Max |
|
166.66 MHz
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Package Equivalence Code |
|
BGA1023,32X32,40
|
Peak Reflow Temperature (Cel) |
|
245
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MC8640DVJ1000HC with alternatives
Compare MC8640DHX1000HE with alternatives