MC8640DVJ1000HC
vs
MC8640DHX1000HE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
FREESCALE SEMICONDUCTOR INC
Package Description
BGA,
33 X 33 MM, CERAMIC, FCBGA-1023
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
16
32
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
64
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B1023
S-CBGA-B1023
Length
33 mm
33 mm
Low Power Mode
YES
YES
Number of Terminals
1023
1023
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Seated Height-Max
2.77 mm
2.97 mm
Speed
1000 MHz
1000 MHz
Supply Voltage-Max
1.1 V
1.1 V
Supply Voltage-Min
1 V
1 V
Supply Voltage-Nom
1.05 V
1.05 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
33 mm
33 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
2
Rohs Code
Part Package Code
BGA
Pin Count
1023
ECCN Code
3A991
Clock Frequency-Max
166.66 MHz
JESD-609 Code
e0
Moisture Sensitivity Level
3
Package Equivalence Code
BGA1023,32X32,40
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
30
Compare MC8640DVJ1000HC with alternatives
Compare MC8640DHX1000HE with alternatives