MC8640DTVU1250HE
vs
MC8640DTVJ1250HE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
FCBGA-1023
BGA,
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.1
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
16
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
166.66 MHz
External Data Bus Width
32
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B1023
S-CBGA-B1023
Length
33 mm
33 mm
Low Power Mode
NO
YES
Number of DMA Channels
4
Number of Terminals
1023
1023
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
HBGA
BGA
Package Equivalence Code
BGA1023,32X32,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
GRID ARRAY
Seated Height-Max
2.77 mm
2.77 mm
Speed
1250 MHz
1250 MHz
Supply Voltage-Max
1.1 V
1.1 V
Supply Voltage-Min
1 V
1 V
Supply Voltage-Nom
1.05 V
1.05 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
33 mm
33 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
2
2
Pbfree Code
JESD-609 Code
e2
Moisture Sensitivity Level
3
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