MC8640DTVU1067NE
vs
MC8640DVJ1067NE
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
|
Package Description |
33 X 33 MM, ROHS COMPLIANT, CERAMIC, FCBGA-1023
|
FCBGA-1023
|
Pin Count |
1023
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
3A991.A.1
|
3A991.A.1
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
16
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
166.66 MHz
|
|
External Data Bus Width |
32
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-CBGA-B1023
|
S-CBGA-B1023
|
JESD-609 Code |
e2
|
e2
|
Length |
33 mm
|
33 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
1023
|
1023
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1023,32X32,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
245
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
2.97 mm
|
2.77 mm
|
Speed |
1067 MHz
|
1067 MHz
|
Supply Voltage-Max |
1 V
|
1 V
|
Supply Voltage-Min |
0.9 V
|
0.9 V
|
Supply Voltage-Nom |
0.95 V
|
0.95 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
Tin/Silver (Sn/Ag)
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
33 mm
|
33 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
2
|
2
|
|
|
|
Compare MC8640DTVU1067NE with alternatives
Compare MC8640DVJ1067NE with alternatives