MC8087-2/B
vs
5962-8944903QX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
INTEL CORP
Part Package Code
DIP
DIP
Package Description
DIP-40
DIP,
Pin Count
40
40
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
20
Barrel Shifter
NO
Boundary Scan
NO
NO
Bus Compatibility
8086; 8088; 80186; 80188
Clock Frequency-Max
8 MHz
16 MHz
External Data Bus Width
16
16
JESD-30 Code
R-CDIP-T40
R-GDIP-T40
Number of Terminals
40
40
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Current-Max
475 mA
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
HMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
uPs/uCs/Peripheral ICs Type
MATH PROCESSOR, COPROCESSOR
MATH PROCESSOR, COPROCESSOR
Base Number Matches
1
1
ECCN Code
3A001.A.2.C
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Compare MC8087-2/B with alternatives
Compare 5962-8944903QX with alternatives