MC8087-2/B
vs
5962-8944903QX
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
INTEL CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP-40
|
DIP,
|
| Pin Count |
40
|
40
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
20
|
|
| Barrel Shifter |
NO
|
|
| Boundary Scan |
NO
|
NO
|
| Bus Compatibility |
8086; 8088; 80186; 80188
|
|
| Clock Frequency-Max |
8 MHz
|
16 MHz
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
R-CDIP-T40
|
R-GDIP-T40
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Supply Current-Max |
475 mA
|
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
HMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, COPROCESSOR
|
MATH PROCESSOR, COPROCESSOR
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A001.A.2.C
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
Compare MC8087-2/B with alternatives
Compare 5962-8944903QX with alternatives