MC80364K64L-8R5
vs
IS61LV6464-6PQI
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
MONOLITHIC SYSTEM TECHNOLOGY INC
|
INTEGRATED SILICON SOLUTION INC
|
| Package Description |
,
|
PLASTIC, QFP-128
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
128
|
| Access Time-Max |
|
6 ns
|
| Additional Feature |
|
SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE
|
| Clock Frequency-Max (fCLK) |
|
83 MHz
|
| I/O Type |
|
COMMON
|
| JESD-30 Code |
|
R-PQFP-G128
|
| JESD-609 Code |
|
e0
|
| Length |
|
20 mm
|
| Memory Density |
|
4194304 bit
|
| Memory IC Type |
|
CACHE SRAM
|
| Memory Width |
|
64
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
128
|
| Number of Words |
|
65536 words
|
| Number of Words Code |
|
64000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
64KX64
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
FQFP
|
| Package Equivalence Code |
|
QFP128,.67X.93,20
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
FLATPACK, FINE PITCH
|
| Parallel/Serial |
|
PARALLEL
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
3.4 mm
|
| Standby Current-Max |
|
0.01 A
|
| Standby Voltage-Min |
|
3.14 V
|
| Supply Current-Max |
|
0.22 mA
|
| Supply Voltage-Max (Vsup) |
|
3.63 V
|
| Supply Voltage-Min (Vsup) |
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
14 mm
|
|
|
|
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