MC803256K36L-7R5I
vs
CY7C1317V18-250BZC
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
MOSYS INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
QFP,
|
13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
|
| Pin Count |
100
|
165
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Access Time-Max |
|
0.35 ns
|
| Additional Feature |
|
PIPELINED ARCHITECTURE
|
| Clock Frequency-Max (fCLK) |
|
250 MHz
|
| I/O Type |
|
COMMON
|
| JESD-30 Code |
|
R-PBGA-B165
|
| JESD-609 Code |
|
e0
|
| Length |
|
15 mm
|
| Memory Density |
|
16777216 bit
|
| Memory IC Type |
|
DDR SRAM
|
| Memory Width |
|
8
|
| Moisture Sensitivity Level |
|
3
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
165
|
| Number of Words |
|
2097152 words
|
| Number of Words Code |
|
2000000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
2MX8
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TBGA
|
| Package Equivalence Code |
|
BGA165,11X15,40
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, THIN PROFILE
|
| Parallel/Serial |
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
|
220
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Standby Voltage-Min |
|
1.7 V
|
| Supply Voltage-Max (Vsup) |
|
1.9 V
|
| Supply Voltage-Min (Vsup) |
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
|
1.8 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
13 mm
|
|
|
|
Compare MC803256K36L-7R5I with alternatives
Compare CY7C1317V18-250BZC with alternatives