MC74VHC541DT
vs
MC74VHC541DTR2
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
TSSOP
Package Description
TSSOP,
TSSOP, TSSOP20,.25
Pin Count
20
Reach Compliance Code
unknown
unknown
Family
AHC/VHC
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e4
e0
Length
6.5 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
NOT SPECIFIED
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
12 ns
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
4.4 mm
Base Number Matches
5
4
Control Type
ENABLE LOW
Load Capacitance (CL)
50 pF
Max I(ol)
0.008 A
Package Equivalence Code
TSSOP20,.25
Packing Method
TAPE AND REEL
Power Supplies
2/5.5 V
Prop. Delay@Nom-Sup
8 ns
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