MC74VHC4066DR2
vs
HEF4051BDF
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP, SOP14,.25
|
DIP,
|
| Pin Count |
14
|
16
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-PDSO-G14
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
|
| Length |
8.65 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Normal Position |
NO
|
|
| Number of Channels |
4
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
16
|
| Off-state Isolation-Nom |
40 dB
|
50 dB
|
| On-state Resistance Match-Nom |
30 Ω
|
5 Ω
|
| On-state Resistance-Max (Ron) |
200 Ω
|
175 Ω
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output |
SEPARATE OUTPUT
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
12 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Switch-off Time-Max |
35 ns
|
230 ns
|
| Switch-on Time-Max |
30 ns
|
80 ns
|
| Switching |
MAKE-BEFORE-BREAK
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
|
|
|
Compare MC74VHC4066DR2 with alternatives
Compare HEF4051BDF with alternatives