MC74VHC257DTG
vs
74VHC157N
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ONSEMI
NATIONAL SEMICONDUCTOR CORP
Part Package Code
TSSOP-16
Package Description
TSSOP-16
0.300 INCH, PLASTIC, DIP-16
Pin Count
16
Manufacturer Package Code
948F-01
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
onsemi
Family
AHC/VHC
AHC/VHC
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
JESD-609 Code
e4
e0
Length
5 mm
19.305 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.008 A
0.008 A
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Characteristics
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
DIP
Package Equivalence Code
TSSOP16,.25
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
14.5 ns
11.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
7.62 mm
Base Number Matches
1
3
Rohs Code
Prop. Delay@Nom-Sup
9.5 ns
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